Higgs Boson Systems Pvt. Ltd.

🔋 **JUST 1 DAY TO GO! | THE BATTERY SHOW INDIA 2026** ⚡ The countdown is almost over! 🚀 **Higgs Boson Systems Pvt. Ltd.** is excited to welcome you to *The Battery Show India 2026 – 4th Edition*, where innovation meets the future of battery technology. 📅 **Dates:** 22–24 October 2026 📍 **Venue:** India Expo Mart & Centre, Greater Noida 🏢 **Hall No.:** 7 📌 **Booth No.:** 153 Explore our advanced solutions for the battery manufacturing industry: 🔹 EV Battery Pack Assembly Lines 🔹 Laser Welding Solutions 🔹 Cell Sorting & Grading Machines 🔹 Battery Testing Equipment 🔹 Industrial Automation Technologies 🤝 Visit our booth to connect with our team and discover how we can support your battery manufacturing journey. 📞 **Contact Us:** +91 6376988694 🌐 [www.higgsbosonsystems.com](https://lnkd.in/gtEuRjqT) 📧 [evsales@higgsbosonsystems.com](mailto:evsales@higgsbosonsystems.com) ✨ **Let's Build a Stronger Battery Future!** 📍 See you tomorrow at **Booth 153, Hall 7!** #TheBatteryShowIndia2026 #HiggsBosonSystems #BatteryTechnology #EVBattery #BatteryManufacturing #LaserWelding #CellGrading #Automation #EnergyStorage #GreaterNoida

🚀 *Precision in Every Cut: UTG & Glass Laser Cutting System* We are pleased to highlight the *UTG & Glass Laser Cutting System*, an advanced solution designed for precision cutting of ultra-thin glass (UTG) and thicker glass substrates used in modern electronics and semiconductor-related manufacturing. Powered by a *picosecond infrared (IR) laser source* and advanced optics from *i3 Engineering*, this system supports precise cutting in straight lines and free-form shapes, helping meet the demanding requirements of next-generation glass processing. 🔹 *Key Features & Capabilities* * Precision laser cutting of thin and thick glass   * Supports straight-line and free-form cutting   * Glass thickness range: *0.03 mm to 1.7 mm*   * Maximum glass loading size: *550 × 550 mm*   * Picosecond IR laser technology for precision processing   * Advanced optics for controlled and accurate cutting  🔹 *Potential Applications* * Ultra-Thin Glass (UTG) processing   * Display and electronic glass manufacturing   * Precision glass components for advanced electronics   * Research and development in next-generation glass technologies  *OEM: i3 Engineering*   *Presented by: Higgs Boson Systems Pvt. Ltd.* As demand grows for thinner, lighter and more precisely engineered glass components, advanced laser-processing technologies play an important role in enabling next-generation manufacturing. #LaserCutting #UltraThinGlass #UTG #GlassProcessing #LaserTechnology #PrecisionEngineering #SemiconductorManufacturing #AdvancedManufacturing #i3Engineering #HiggsBosonSystems

🔬 Precision Wire Bonding for Semiconductor & Microelectronics Applications At Higgs Boson Systems Pvt. Ltd., we are pleased to showcase the UniTemp WB-300-U – Semiautomatic Wire Bonder (Wedge & Ball), a compact and versatile wire bonding system designed for precision bonding applications. Featuring 3 motorized axes, a heated chuck and programmable process control, the WB-300-U supports flexible wire bonding operations for research, development and semiconductor assembly. ⚙️ Key Features & Specifications: * 3 motorized axes — X, Y and Z, with 1.0 µm stated accuracy * Wedge, ball, bump and security ball bonding capabilities * Supports 17–50 µm gold and aluminium wire * Motorized X-Y table with 50 × 50 mm travel * Heated chuck with 60 mm diameter and temperatures up to 250°C * 62 kHz ultrasonic system with PLL control * Motorized wire spool and Electronic Flame-Off (EFO) * 7-inch SIMATIC® touch panel for system control * Stores 32 programs with 50 steps each * Ethernet connectivity and optional camera systems 🧪 Typical Applications: ✔️ Semiconductor device prototyping ✔️ Microelectronics assembly ✔️ Research and development ✔️ Wedge and ball wire bonding ✔️ Die interconnection and packaging ✔️ Academic laboratories and industrial R&D With its compact design, flexible bonding methods and precise motion control, the WB-300-U is suited to a wide range of semiconductor and microelectronics bonding requirements. 🤝 OEM: UniTemp GmbH, Germany ⚙️ Equipment: WB-300-U Semiautomatic Wire Bonder 🏢 Presented by: Higgs Boson Systems Pvt. Ltd. We look forward to supporting India’s growing semiconductor ecosystem by bringing advanced semiconductor assembly and wire bonding technologies closer to research institutions and industry. #Semiconductor #WireBonding #SemiconductorEquipment #Microelectronics #SemiconductorPackaging #BallBonding #WedgeBonding #AdvancedPackaging #RAndD #ElectronicsManufacturing #UniTemp #HiggsBosonSystems #MakeInIndia #SemiconductorIndia

🚀 *3 DAYS TO GO!* 🔋 The countdown is on! We’re excited to welcome you to *The Battery Show India 2026* and showcase innovative battery manufacturing and automation solutions. 📅 *Date:* 22–24 October 2026 📍 *Venue:* India Expo Mart & Centre, Greater Noida 🏢 *Hall No.:* 7 | *Booth No.:* 153 Explore our solutions for: 🔹 EV Battery Pack Assembly Lines 🔹 Laser Welding 🔹 Cell Sorting & Grading 🔹 Battery Testing 🔹 Automation Technologies 🤝 Let’s connect and build a stronger battery future together! 📞 Contact: +91 6376988694 *See you at Booth 153!* ⚡ #TheBatteryShowIndia2026 #BatteryTechnology #EVBattery #BatteryManufacturing #Automation #LaserWelding #HiggsBosonSystems #5DaysToGo

🚀 *5 DAYS TO GO!* 🔋 The countdown is on! We’re excited to welcome you to *The Battery Show India 2026* and showcase innovative battery manufacturing and automation solutions. 📅 *Date:* 22–24 October 2026\ 📍 *Venue:* India Expo Mart & Centre, Greater Noida\ 🏢 *Hall No.:* 7 | *Booth No.:* 153 Explore our solutions for:\ 🔹 EV Battery Pack Assembly Lines\ 🔹 Laser Welding\ 🔹 Cell Sorting & Grading\ 🔹 Battery Testing\ 🔹 Automation Technologies 🤝 Let’s connect and build a stronger battery future together! 📞 Contact: +91 6376988694 *See you at Booth 153!* ⚡ #TheBatteryShowIndia2026 #BatteryTechnology #EVBattery #BatteryManufacturing #Automation #LaserWelding #HiggsBosonSystems #5DaysToGo

🚀 7 DAYS TO GO! Meet Our OEM Partner HESSE at The Battery Show India 2026! We’re excited to showcase the HESSE Heavy Wire Bonder BJ955/959 at The Battery Show India 2026! ⚙️ Key Highlights: ✅ Precision Wire & Ribbon Bonding ✅ High-Productivity Performance ✅ Advanced Automation Capabilities ✅ Innovative Bonding Technology 🤝 Visit Higgs Boson Systems to explore advanced industrial technologies and discuss your application requirements with our team. 📅 Date: 22–24 October 2026 📍 Venue: India Expo Mart & Centre, Greater Noida 🏢 Hall 7 | Booth 153 📞 Contact: +91 6376988694 🌐 www.higgsbosonsystems.com Let’s connect and build the future of advanced manufacturing together! #HiggsBosonSystems #HESSE #TheBatteryShowIndia2026 #WireBonding #SemiconductorTechnology #IndustrialAutomation #AdvancedManufacturing

🔋 **8 DAYS TO GO!** 🚀 The countdown has begun! 🎉 Higgs Boson Systems, in partnership with Sunlaser, invites you to **The Battery Show India 2026** to explore innovative battery manufacturing and automation solutions. 📅 **Date:** 22–24 October 2026 📍 **Venue:** India Expo Mart & Centre, Greater Noida 🏢 **Hall:** 7 | **Booth:** 153 Let’s connect and power the future of battery technology together! ⚡ 📞 Contact: +91 6376988694 #TheBatteryShowIndia2026 #HiggsBosonSystems #Sunlaser #BatteryTechnology #EVBattery #BatteryPackAssembly #LaserWelding #CellSorting #BatteryTesting #Automation #8DaysToGo

🔬 Precision Wire Bonding for Semiconductor & Microelectronics Applications At Higgs Boson Systems Pvt. Ltd., we are pleased to showcase the UniTemp WB-300-U – Semiautomatic Wire Bonder (Wedge & Ball), a compact and versatile wire bonding system designed for precision bonding applications. Featuring 3 motorized axes, a heated chuck and programmable process control, the WB-300-U supports flexible wire bonding operations for research, development and semiconductor assembly. ⚙️ Key Features & Specifications: * 3 motorized axes — X, Y and Z, with 1.0 µm stated accuracy * Wedge, ball, bump and security ball bonding capabilities * Supports 17–50 µm gold and aluminium wire * Motorized X-Y table with 50 × 50 mm travel * Heated chuck with 60 mm diameter and temperatures up to 250°C * 62 kHz ultrasonic system with PLL control * Motorized wire spool and Electronic Flame-Off (EFO) * 7-inch SIMATIC® touch panel for system control * Stores 32 programs with 50 steps each * Ethernet connectivity and optional camera systems 🧪 Typical Applications: ✔️ Semiconductor device prototyping ✔️ Microelectronics assembly ✔️ Research and development ✔️ Wedge and ball wire bonding ✔️ Die interconnection and packaging ✔️ Academic laboratories and industrial R&D With its compact design, flexible bonding methods and precise motion control, the WB-300-U is suited to a wide range of semiconductor and microelectronics bonding requirements. 🤝 OEM: UniTemp GmbH, Germany ⚙️ Equipment: WB-300-U Semiautomatic Wire Bonder 🏢 Presented by: Higgs Boson Systems Pvt. Ltd. We look forward to supporting India’s growing semiconductor ecosystem by bringing advanced semiconductor assembly and wire bonding technologies closer to research institutions and industry. #Semiconductor #WireBonding #SemiconductorEquipment #Microelectronics #SemiconductorPackaging #BallBonding #WedgeBonding #AdvancedPackaging #RAndD #ElectronicsManufacturing #UniTemp #HiggsBosonSystems #MakeInIndia #SemiconductorIndia

🔋 *ONLY 09 DAYS TO GO! | THE BATTERY SHOW INDIA 2026* ⚡ The countdown has begun! 🚀 Higgs Boson Systems Pvt. Ltd. is excited to announce our participation in *The Battery Show India 2026 – 4th Edition*, one of the key events for battery technology and innovation. 📅 *Dates:* October 22–24, 2026 📍 *Venue:* India Expo Mart & Centre, Greater Noida, India 🏢 *Hall No.:* 7 📌 *Booth No.:* 153 Visit us to explore our solutions for *EV Battery Pack Assembly Lines, Laser Welding, Cell Sorting & Grading, Battery Testing, and Automation Technologies.* Our team looks forward to connecting with industry professionals, OEMs, manufacturers, and technology partners to discuss new opportunities and innovative battery manufacturing solutions. 🤝 *Let's connect and power the future of battery technology together!* 📩 Email: evsales@higgsbosonsystems.com 🌐 Website: www.higgsbosonsystems.com #TheBatteryShowIndia2026 #HiggsBosonSystems #BatteryTechnology #EVBattery #BatteryManufacturing #LaserWelding #Automation #EnergyStorage #MakeInIndia

🔬 Behind Every Advanced Semiconductor Device Is a Precisely Engineered Thin Film. Have you ever wondered how ultra-thin layers of material are deposited onto semiconductor wafers with the precision required for today’s advanced electronic devices? This is where Plasma-Enhanced Chemical Vapor Deposition (PECVD) plays a vital role. ⚙️ At Higgs Boson Systems Pvt. Ltd. (HBPL), we are committed to bringing advanced semiconductor fabrication technologies to India’s rapidly growing semiconductor ecosystem. We are pleased to highlight PECVD systems from TES, designed to support advanced thin-film deposition processes for semiconductor research, development, and manufacturing. ✨ Why is PECVD important in semiconductor fabrication? 🔹 Versatile Thin-Film Deposition: Supports functional films such as SiN, SiO₂, SiON, and SiCN, depending on the system configuration and process requirements. 🔹 Multi-Process Capability: Enables different deposition processes to address diverse fabrication needs. 🔹 Process Control: Supports controlled, uniform thin-film deposition for demanding semiconductor applications. 🔹 Lower-Temperature Processing: Can enable deposition at lower temperatures than conventional thermal CVD, depending on the material and process. From material selection to deposition parameters, every detail matters when engineering thin films for next-generation semiconductor technologies. 🚀 Advancing semiconductor fabrication capabilities in India, one process at a time. 📩 Connect with HBPL to explore advanced thin-film deposition solutions for your research and manufacturing requirements. #HiggsBosonSystems #Semiconductor #PECVD #ThinFilmDeposition #SemiconductorManufacturing #AdvancedMaterials #VacuumTechnology #MakeInIndia #TES Anuj Garg AFSAL SHARAF Rajendra Kumar Singh Varun Bhardwaj Vikas Saini Vipinraj Singh Nitish Kumar Borah Rituraj Baruah