Samsung Foundry Addresses Memory Wall in AI and HPC

🌟 Beyond Compute: Integrated Solutions for AI Performance One thing is clear as AI evolves from Generative AI to Agentic AI, and now towards Physical AI: performance is no longer defined by compute alone. These increasingly complex AI technologies require unprecedented amounts of data, and AI systems are required to process these huge data without bottleneck or latency. The future of AI system architecture will be shaped by how tightly #SamsungSemiconductor’s capabilities across from memory to advanced packaging and system-level integration can be engineered together. With its IDM-based strengths, Samsung Semiconductor delivers solutions optimized for the demands that AI systems are already placing on infrastructure today. Our recent advances such as #HBM4, #HBM4E and a new thermal architecture designed for the #HBM5 serve as a testament to our approach to architecting beyond single chips - addressing the growing performance, bandwidth, capacity, and thermal challenges of AI systems. This is Samsung Semiconductor’s approach to Integrated AI Semiconductor Solutions — architecting AI systems through the full integration of system-level innovation. This is what we mean by #ArchitectingAISystems.

The semiconductor landscape is rapidly transitioning to chiplet-based architectures, driven by growing AI and high-performance computing (HPC) demands. As the adoption of the UCIe (Universal Chiplet Interconnect Express) accelerates, success depends not only on standardized chiplet communication but also on leading-edge process technology, scalable manufacturing, and an integrated design-to-production solution. Samsung and its ecosystem are playing a key part in moving this standard forward. Advanced chiplets require a collaborative ecosystem, which Samsung provides through our comprehensive one-stop solution. As customers increasingly adopt chiplet architectures, we are actively engaged in ecosystem initiatives to deliver customizable platforms that maximize efficiency and accelerate development. Samsung bridges the gap from design to delivery by integrating leading-edge process technology, including our advanced 2nm node, with advanced packaging. To support growing global demands, we are strategically scaling our manufacturing presence across both Korea and the United States. By combining advanced packaging, UCIe interoperability and a collaborative ecosystem, Samsung is empowering designers to push the boundaries of system-based design. Read more here: https://lnkd.in/eaJa5zY9 #UCle #SamsungFoundry #SamsungSemiUS

HBM4 is the culmination of Samsung’s integrated semiconductor capabilities. Learn more about its capabilities on the newly-launched #HBM4 page: https://lnkd.in/gpDkcdww   #SamsungSemiconductor is the world’s only fully integrated semiconductor company. Bringing together expertise across memory, logic, foundry, and advanced packaging, Samsung delivers deep system-level optimization to provide HBM4 that offers industry-leading performance and reliable quality.   HBM4 breaks new ground with its bold adoption of the industry’s first #1cDRAM and a #4nm foundry-based logic base die. Through advanced core technologies and process-optimized design, it delivers stable performance of up to 13.0Gbps.   The world of AI continues to evolve and Samsung HBM4 sets a new standard for performance and efficiency.   Key specifications: ✅ Leading-edge 1c DRAM + 4nm logic base die ✅ Transfer speed up to 13Gbps ✅ Bandwidth up to 3.3TB/s per stack (2.7× improvement)* ✅ 2,048 I/O pins (2× increase)* *Compared to HBM3E

At #FMS2026, Samsung Semiconductor presented the keynote, "3D Innovations in Memory & Storage Architecture," outlining its vision for overcoming the next generation of AI infrastructure bottlenecks. 📌 Key insights from the keynote: 🔹 AI performance depends on optimizing the entire system—not just individual memory or storage devices. 🔹 Future AI infrastructure must address memory bandwidth, memory capacity, data movement, power delivery and thermal management as one integrated architecture. 🔹 3D memory and storage architecture will play a critical role in enabling higher system performance, greater energy efficiency and scalable AI infrastructure. 🔹 Samsung showcased next-generation technologies including advanced #HBM, #zHBM, #V10BVNAND and #zNAND_O, demonstrating how memory innovation can help unlock the next era of AI systems. With industry-leading capabilities spanning memory, foundry and advanced packaging, Samsung is uniquely positioned to optimize AI systems at the architecture level through end-to-end integration. Together with customers and ecosystem partners, Samsung will continue advancing the future of AI infrastructure through innovation in memory and storage. #SamsungSemiconductor #SamsungMemory #FMS2026 #AgenticAI #3DArchitecture #HBM #VNAND #zHBM #zNAND_O

✨ Bringing Memory Closer to Compute: zHBM As AI models continue to grow, moving data between memory and AI accelerators is becoming a critical challenge for next-generation AI infrastructure. zHBM is Samsung Semiconductor's next-generation 3D memory architecture that vertically stacks HBM directly above the AI accelerator, reducing the distance between memory and compute. At FMS 2026, Samsung Semiconductor unveiled the industry's first zHBM concept model, introducing a new approach to scaling AI performance, efficiency, and system integration. ✅ Up to 8× higher performance than HBM5 through zHBM's next-generation interface system ✅ More than 10× the memory density of HBM5 enabled by wafer-bonded zHBM architecture ✅ 3× higher energy efficiency and over 50% lower thermal resistance than HBM5 ✅ Customized IP integration between memory and AI accelerators for customer-specific architectures By bringing memory closer to compute, zHBM represents Samsung Semiconductor's vision for the next generation of AI memory architecture. 🚀 Explore Samsung Semiconductor's latest innovations unveiled at FMS 2026. #SamsungSemiconductor #zHBM #HBM #AIInfrastructure #FMS2026

The landscape of data storage is evolving faster than ever, and Samsung Semiconductor is proud to be at the forefront as a dedicated member of the NVM Express organization.   In this NVM Express Member Spotlight, Michael Allison, Sr. Director of Product Planning and NVM Express Board Member, dives into:  • The "Why" – Insight into why Samsung joined NVM Express and our commitment to the ecosystem.  • The Collaboration – How our active contributions to NVM Express working groups help shape global specs.  • The Innovation – A look at the cutting-edge products we’ve developed using the NVMe™ family of specifications.   We are excited to continue our close collaboration with NVM Express to push the boundaries of storage virtualization and deliver world-class solutions to our customers. #SamsungSemiUS

We’ve been busy at #FMS206 this past week! Visitors stopped by to see how our next-gen 3D architectures are helping overcome AI data bottlenecks and powering future AI systems. From interactive tech demos and cutting-edge memory and storage technologies to expert-led mini theater sessions, our booth was buzzing with the future of AI infrastructure. A few major event highlights: 💠Keynote Spotlight: Our experts presented on "3D Innovations in Memory & Storage Architecture," where we shared Samsung’s vision for overcoming the next generation of AI infrastructure bottlenecks. 💠FMS 2026 Best of Show Awards: We were honored to be recognized for our leadership in next-generation memory innovation with two major wins: • 3D & NAND Innovation Award: For our V10 BV-NAND, advancing next-generation V-NAND technology with wafer bonding architecture to deliver higher density, performance, and power efficiency. • Next-Gen Memory Award: For our LPDDR5X-PIM, bringing processing-in-memory capabilities to LPDDR memory for more efficient data processing and lower power consumption during heavy AI workloads. Samsung’s innovative technologies are actively paving the way for the future of AI and memory-centric architecture. Take a look at 3 days of FMS, summed up in about 30 seconds! #SamsungSemiconductor #SamsungMemory #V10BVNAND #LPDDR5XPIM #3DArchitecture #AgenticAI

When developing Samsung #HBM4 and #HBM4E, we adopted D1c DRAM and a 4nm logic base die to elevate product excellence. This was more than a step toward higher performance. It was a bold move to redefine what next-generation HBM could achieve, backed by our deep expertise from memory to advanced packaging. To make this possible, we brought our full capabilities together through meticulous DTCO, or Design-Technology Co-Optimization. By optimizing design and process technology together from the early stages, we are enhancing both product maturity and system-level performance. Built on our comprehensive semiconductor leadership, HBM4 and HBM4E represent a new level of high-bandwidth memory innovation, combining speed, efficiency, and integration to meet the growing demands of AI systems. This represents more than just a specification. It reflects our passion for technology, its bold spirit of innovation, and its commitment to architecting the next generation of high-bandwidth memory for #AI systems. #SamsungSemiconductor

🏆 Samsung Semiconductor Wins Two FMS 2026 Best of Show Awards Samsung Semiconductor has been honored with two FMS 2026 Best of Show Awards, recognizing our leadership in next-generation memory innovation for the AI era. 📌 Award-winning innovations: 🏆 3D & NAND Innovation Award V10 BV-NAND — Advancing next-generation V-NAND technology with wafer bonding architecture, delivering higher density, performance and power efficiency for future AI infrastructure. 🏆 Next-Gen Memory Award LPDDR5XPIM — Bringing processing-in-memory capabilities to LPDDR memory, enabling more efficient data processing and lower power consumption for AI workloads. As AI infrastructure continues to evolve, innovation in memory architecture is becoming a key driver of system performance, energy efficiency and intelligent computing. These awards recognize Samsung's commitment to advancing technologies that help architect the next generation of AI systems—from breakthrough NAND innovations to intelligent memory solutions. We sincerely thank the FMS organizers, judges, our customers, ecosystem partners and Samsung engineers whose collaboration and dedication made these achievements possible. Together, we will continue Architecting AI Systems through breakthrough memory and storage innovations. #SamsungSemiconductor #SamsungMemory #FMS2026 #V10BVNAND #LPDDR5XPIM

The energy from last week is still going strong! We're reflecting on the incredible momentum and collaboration from the Samsung Advanced Foundry Ecosystem (SAFE™) Forum, where industry leaders gathered at our San Jose campus to explore "The Nexus for Silicon Intelligence." From the packed keynote sessions to the dynamic partner pavilion, the spirit of co-creation was on full display. Together, we explored the technologies shaping the AI era - from AI-driven silicon and next-generation compute to scalable infrastructure powering real-world AI. Highlights included visionary insights from leaders across the ecosystem, meaningful connections between customers, partners, and Samsung experts, and hands-on technology showcases demonstrating the innovations driving the future of silicon intelligence. A huge thank you to our partners and customers for making the SAFE™ Forum such a remarkable success. The future of silicon intelligence is not just being imagined - it's being built together. Check out the highlights in our recap video below! #SAFE2026 #SamsungFoundry #SamsungSemiUS