Synopsys Inc

Do something that you’re genuinely curious about – and happiness will follow. It’s as simple as that. For as long as I can remember, I was very interested in chip design – specifically Very Large Scale Integration for semiconductor chip design (VLSI) – and that curiosity led me to eventually earn a Ph.D in Electrical and Computer Engineering. I’m grateful for all the educators in my life from Indian Institute of Technology, Kharagpur (see my class photo below, I'm third row, fifth from the right) to the University of Illinois Urbana-Champaign that supported boundless curiosity and steered me in the right direction – it might just be why my career has had 3 distinct chapters – from academia to industry to corporate tech. I just keep learning! When I’m hiring talent today at Synopsys Inc– candidates have to be curious – and they have to be passionate. The next wave of AI will require not only hard-working engineers – but innovation will come from those who are passionately curious. As AI advances at unprecedented speed, real innovation will come from engineers who constantly question assumptions, explore what’s possible, and push beyond established boundaries. In this era of rapid change, curiosity paired with passion will be a defining force in unlocking the most meaningful breakthroughs. I talked more about my advice for recent grads (#GradsGuide2026) in my conversation with Sachin Syal: https://lnkd.in/gVs622aJ

https://lnkd.in/eTNVpSgt A couple of weeks ago I sat down with Synopsys Inc CEO Sassine Ghazi to discuss how the shift toward 3D stacking and chiplet architectures is fundamentally changing the software we use to build silicon. With the industry moving headfirst into a brutal one-year design rhythm, it is perceived that human engineers can no longer explore the massive design spaces required for modern chips alone. That means the demand for more complete tools is higher than ever. Sassine and I discuss how Synopsys is using the Ansys acquisition to integrate manufacturing physics, specifically to solve aspects related to thermal warpage, die cracking, and electromagnetics. By enabling these directly into the early design phase, it can prevent the "overdesign" of uncompetitive products. We also talk about the emergence of Agentic AI in the design workflow. This focuses on multi-agent dynamic orchestration, where agents call solvers to iterate on designs. The goal is to find optimizations that would be impossible to cover manually. We also touched on Synopsys' role in helping Rapidus Corporation stand up a leading-edge foundry in Japan from scratch, highlighting that the tight coupling between architecture and manufacturing is now the most critical piece of the semiconductor puzzle. Many thanks to Sassine, Andrea, Kelli, Cara, the team and others for putting this together!

We are in the most transformative decade in modern engineering, and it’s shaped by the convergence of silicon, software, systems, and physics. Intelligent systems are increasingly software-defined, AI-enabled, and physically embodied, leading to unprecedented design complexity and cost.    A fundamental shift in how products are engineered is required, including co-design of software and hardware, electronics and physics, and harnessing digital twins to design, test and refine products before physical production. Increased use of AI to enhance human capabilities is critical to address the growing engineering capacity constraint.   I spoke about these trends at our inaugural Synopsys Converge conference last month, where we also announced new engineering solutions to advance how customers design, verify, and deliver next generation AI-powered products, including:   ☑️ Multiphysics Fusion technology—a suite of EDA solutions that integrate Ansys multiphysics engines directly into Synopsys’ EDA portfolio to help customers’ R&D teams address electromagnetics, thermal, and mechanical challenges earlier in the silicon design flow.   ☑️ The industry’s first L4 multi-agent workflow for chip design--powered by AgentEngineer™ technology, the workflow includes agents that reason, learn, plan, and act across design and verification tasks — translating specifications into RTL, generating testbenches, and iterating toward clean, synthesizable results.   Learn more about these and other key Synopsys Inc announcements: https://lnkd.in/g3JcJMCn

At Synopsys Inc Converge (#Converge2026) we announced two key chip design innovations – multiphysics fusion across design and signoff and our new L4 agentic AI EDA capabilities. Together, these innovations advance the next generation of system and silicon design. Our new multiphysics fusion capabilities represents a significant shift: a unified architecture that couples electrical, thermal, electromagnetic, mechanical, and reliability physics directly into chip, package, and system design loops. By synchronizing high‑fidelity Ansys simulation data with Synopsys implementation & signoff tools, engineers can now: ▪️ Propagate system‑level thermal and EM conditions directly into silicon optimization ▪️ Validate signal/power integrity and thermal reliability earlier in the cycle ▪️ Maintain a closed modeling loop across chip–package–board–system This is the kind of convergence required as designs push into high‑density 3DIC/multi‑die architectures, and extreme performance envelopes. It is a new approach to reducing late‑stage surprises, minimizing margins to enable better PPA and integrated, simplified workflows.   We also unveiled a major step forward in AI for EDA: the industry’s first Level‑4 agentic workflow, powered by Synopsys AgentEngineer technology. This multi‑agent, adaptive learning system orchestrates specialized EDA agents to autonomously: ▪️ Generate spec‑compliant RTL and testbench from natural‑language or formal inputs. ▪️ Run on-the-fly linting and structural checks. ▪️ Produce unit‑level testbenches. ▪️ Optimize PPA with RTL re-writes. ▪️ Execute iterative verification & debug loops autonomously.   The front‑end cycle traditionally requires 3-4 months on a large SoC. With AgentEngineer, customers are already achieving 2x productivity – and in some cases up to 5x. Synopsys agentic stack interoperates with customer agents and enterprise data, with collaborations underway with AMD, Microsoft (Foundry + Discovery), and NVIDIA. Check out the demo: Accelerate Innovation with First Orchestrated Multi‑Agent Workflow for Chip Design: https://lnkd.in/g2F5hpAg Both innovations reflect our commitment to pushing the boundaries of what’s possible in system and silicon design.