AI accelerators are raising the bar for IC test, with growing demands from singulated die and final test to system-level and in-system validation. In Semiconductor Engineering, Teradyne’s Jeorge Hurtarte, PhD, MBA explains how advanced packages with HBM and high-speed interfaces require more scalable DFT and test approaches. Learn how test strategies are adapting for AI accelerators and advanced packaging: https://hubs.li/Q04cQMDb0
About us
Teradyne brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. Its robotics offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs.
- Website
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http://www.teradyne.com
External link for Teradyne
- Industry
- Semiconductor Manufacturing
- Company size
- 5,001-10,000 employees
- Headquarters
- North Reading, MA
- Type
- Public Company
- Founded
- 1960
- Specialties
- Electronics Manufacturing, Robotics, Semiconductor Test, Industrial Automation, Production Board Test, System Level Test, Storage Test, Wireless Test, Memory Test, and Silicon Photonics
Locations
Employees at Teradyne
Updates
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We’re thrilled to announce that Teradyne has acquired TestInsight, a leader in semiconductor test development, validation, and conversion software. This strategic acquisition strengthens our leadership in design-to-test solutions and accelerates time-to-market for the most complex AI and data center devices. By combining TestInsight’s cutting-edge tools with Teradyne’s advanced ATE platforms, we’re enabling a seamless design-to-test workflow that reduces debug cycles, improves test coverage, and ensures earlier test program readiness. Welcome, TestInsight team! We’re excited to shape the future of semiconductor testing together. 🔗 Read the full press release here: https://hubs.li/Q04cjZQ80 #Semiconductors #AI #DataCenters
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Teradyne is excited to join the International Semiconductor Industry Group Executive Summit for both the Silicon Valley and Power events! These events brings together top industry leaders from the semiconductor sector, offering an incredible opportunity to connect, collaborate, and share insights on the future of our industry. We’re also excited to have our division leaders from Silicon Photonics, Compute and Power Test share their expertise during their three panel sessions. Look forward to engaging with everyone at the summit!✨
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Teradyne reposted this
Inside the room at ISIG Executive Summit USA 2026 Advanced Semiconductor Testing Methodologies, Test Automation, Yield Optimization, and System-Level Validation. As chip complexity accelerates, the gap between those who lead on yield and those who don't is widening fast. This panel brings together six of the industry's foremost experts to tackle it head-on. No recordings. No press. No exceptions. Moderator: Dr. Mike Slessor — President & CEO, FormFactor Inc. Panelists: Phil Martin — VP Sort Test Technology Development, Intel Foundry Michael Campbell — SVP Engineering, Qualcomm John Yi — Fellow & Sr. Director Test Engineering, AMD Roy Chorev — VP & GM Compute Test Division, Teradyne Richard Lathrop — VP SOC Business Development, Advantest Ramanan Thiagarajah — SVP Operations Engineering, Marvell Technology Silicon Valley · April 20–21 · Sold out. Access the waitlist here: 🔗 https://lnkd.in/dqGTwTXw #Semiconductors #ISIG #SemiconductorTest #TestEngineering #YieldOptimization #SiliconValley Jubed Miah, Salah Nasri, Kevin Dei, Mia Chen, Elsa Medin, Michelle Yan, Sephora Maio, Germantas Kneita, Amy Leong, Christine Nolan, Christine Dunbar
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Join us at CadenceLIVE to hear from Teradyne’s James McCollum as he share insights on using Cadence technologies to drive innovation and efficiency in electronic design and simulation for next generation semiconductor testers. 🔗 Register today!: https://hubs.li/Q04b55tp0
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Digital twins are gaining momentum as a way to connect design, packaging, and test with a unified, data-driven view across the manufacturing flow. In Semiconductor Engineering, Teradyne’s Eli Roth explains that these systems bring together multi-physics data and simulation environments to enable deeper insight into complex interactions and help teams debug and validate devices before costly failures occur. Learn how engineers are using AI to connect data and advance digital twin capabilities: https://hubs.li/Q049LqJK0
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Test earlier. Know more. With Omnyx, structural, high-speed interconnect, and operational testing come together in one platform to identify critical faults in complex AI and data center boards before final integration. Learn more: https://bit.ly/3PJUDYt #AIHardwareTesting #TestAutomation
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As #AI-driven bandwidth demands accelerate, integrating #SiPh and #CPO test solutions into the manufacturing process is becoming critical to scaling photonics. In this Lightwave Online e-book, Teradyne and Quantifi Photonics share insights on implementing a test strategy from bench validation to high-volume that enables a seamless path to scale. 📖 Read the full publication to explore our insights: https://bit.ly/4tuFMQi
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Come meet Teradyne at the Veterans Job Fair today at Gillette Stadium in MA from 11am-3pm! Teradyne is a great place to work as a veteran, we've even been nominated as a 2025 VETS Indexes Recognized Employer ⭐ and have an active Veterans Employee Resource Group. Register here: https://bit.ly/4vdnMeW
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Consistent tool matching across test and metrology is becoming more critical as device complexity increases and supply chains expand. In Semiconductor Engineering, Teradyne’s Eli Roth explains that tighter guard bands and advanced packaging require greater repeatability and place added pressure on test operations to reduce variation. Learn how engineers are using machine learning to address these challenges and improve process control: https://bit.ly/4v0ZeFT
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