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This is an exciting opportunity to work with a semiconductor startup that has raised over $100m in funding and is rapidly growing. This role involves working on mechanical designs for advanced electronic packaging using Thermal FEA.
Essential Skills:
B.S. or M.S. in Mechanical Engineering, Electrical Engineering, Material Engineering etc.
Needs to have experience working on packaging for Semiconductor Integrated Circuits
Knowledge of Solidworks (or other design packages) to create packaging designs
Knowledge of FEA (Finite Element Analysis) with Ansys or Abaqus etc.
Experience working on Thermal or Structural analysis
Knowledge of packaging standards including JEDEC
Has previously worked on 2.5D or 3D Packaging
Experience with Through-Silicon Via (TSV)
Company Benefits:
401K
Bonus
Stock/Equity
Full Premium Healthcare
Seniority level
Mid-Senior level
Employment type
Full-time
Job function
Engineering
Industries
Semiconductor Manufacturing
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