AI infrastructure is evolving rapidly, and memory and storage architectures are becoming critical to scalability. Meet Samsung Semiconductor experts at the 2026 OCP Global Summit. 🤝 Join our Executive, Expo Hall, and Breakout Sessions to explore Samsung Semiconductor's approach to addressing AI infrastructure scalability through speed, memory expansion, and persistence. Discover technologies including: 🔹 CXL & Scalable Memory Tiering 🔹 AI Workload & KV Cache Optimization 🔹 Storage Performance & Hardware Integrity Explore how Samsung Semiconductor's memory and storage architectures are helping shape the agentic AI era. 🌐 https://lnkd.in/eiyB_FpV #SamsungSemiconductor #SamsungMemory #OCP2026 #KVCache #Tokenization #SamsungMAXLab #SamsungGOST
As AI workloads continue to scale, memory architecture becomes an increasingly important part of the performance equation. Efficient KV-cache management and memory tiering can help address the trade-offs between bandwidth, latency, and capacity. Coordinating these elements at the system level will be essential to scaling inference efficiently.
Have a great 2026 OCP Global Summit!
CXL and HBM, focusing on their key differences and technical significance: • HBM (High Bandwidth Memory) functions as a ultra-fast, premium short-term memory layer that is vertically stacked and directly integrated next to the GPU to maximize data processing speed for AI workloads. • CXL (Compute Express Link) serves as a flexible memory expander that connects external DRAM to the existing system via standard interfaces, drastically increasing overall memory capacity at a much lower cost. • While HBM focuses on overcoming the speed bottleneck by delivering massive data pipelines to a single processor, CXL addresses the capacity bottleneck by allowing multiple processors to efficiently pool and share massive amounts of memory.