AI workloads demand the uninterrupted production of highly complex, defect-sensitive chips. Samsung Semiconductor makes this possible through precision and infrastructure reliability. ⚙️ Inside the Fab, precision is built into every facility: • Cleanroom: Cleanliness measured based on the particle count allowed per cubic foot • Cleanroom suit: Worn to prevent contamination and static damage • OHT: Automated rail system moving wafers along the fab ceiling • FOUP: Sealed pod protecting wafers in transit between processes 🔨 Beyond the walls, infrastructure is built for 24/7 production: • Power: Stable electricity is supplied across every building and system on campus • Water: Approximately 70,000 tons of wastewater is treated daily Next, we head to the P5 construction site, where the next chapter is being built. Stay connected for Episode 3. #SamsungSemiconductor #PyeongtaekCampus #ScalingSemiconductorExcellence

Scaling Semiconductor Excellence Part 6: Pushing the Limits at Hwaseong Campus How far can semiconductor technology go? At Samsung Electronics’ Hwaseong Campus, advanced processes, AI-driven manufacturing and integrated R&D come together to push semiconductor technology further. 🏭 The Technologies Behind Hwaseong Campus • V1 Line: Samsung Electronics’ first production line dedicated to extreme ultraviolet (EUV) lithography. • 17 Line: An advanced semiconductor mass-production line that brings cutting-edge technology to scale. • HPC Center: A high-performance computing data center where tens of thousands of servers power an AI-based smart manufacturing platform. • DSR: An integrated R&D center that brings together research capabilities in Memory, System LSI and production technology. Advanced processes. AI-driven manufacturing. Integrated R&D. Together, they drive innovation at Hwaseong Campus and push the limits of semiconductor technology. How is Samsung Electronics’ semiconductor legacy shaping its future? Find out in the next episode. Stay connected. #SamsungSemiconductor #HwaseongCampus #ScalingSemiconductorExcellence

Every era of computing is defined by the infrastructure that makes it possible.   For decades, semiconductor progress relied on transistor scaling. But in the #AI era, that model is evolving. Performance is no longer about a single chip - it’s about how an entire integrated system comes together.   As AI and HPC workloads scale, we are facing critical bottlenecks - data movement and memory bandwidth constraints, rising power density and thermal limits.   The solution? Heterogeneous integration.   Advanced packaging is no longer just a backend assembly step. It has evolved into a critical architectural layer shaping the future of next-generation computing.   Read our latest tech blog to see why advanced packaging and system co-optimization matter: https://lnkd.in/gbE-ctnA #AdvancedPackaging #SamsungFoundry #SamsungSemiUS

In case you missed it, last week we announced that we have begun mass production of our industry-leading #HBM4 and have shipped commercial products to customers. Some highlights: ✓ HBM4 with consistent transfer speed of 11.7Gbps, capable of up to 13Gbps for #AI computing ✓ HBM4 DRAM with 4nm logic base die maximizes performance, reliability and energy efficiency for next-generation datacenters ✓ #SamsungSemiconductor's secure process technology and supply capabilities strengthen our HBM roadmap beyond HBM4 Check out the full press release here: https://lnkd.in/gWsSzyuM

📘 Architecting AI Systems through Integrated Innovation Semiconductors are no longer simply standalone components. As multimodal and agentic AI drive growing demand for high-performance inference, AI is rapidly evolving into a system-scale industry. This is changing the role of semiconductors; it is becoming a critical part of AI system architecture. From memory to advanced packaging, #SamsungSemiconductor is constantly innovating to deliver customer-optimized AI memory solutions with system-level performance. Furthermore, we are architecting AI systems through cutting-edge technology innovation, advanced AI-powered manufacturing, and close partner collaborations across the semiconductor ecosystem. Stay tuned to learn more about how we are #ArchitectingAISystems.

Innovation moves forward when diverse perspectives come together. This International Women’s Day, we are spotlighting women across Samsung Semiconductor’s global teams who are shaping the future of technology through engineering excellence, leadership, and a commitment to continuous learning. From imagining new solutions to mentoring the next generation of innovators, their voices remind us that progress is built on curiosity, confidence, and collaboration. Swipe through to hear their stories and insights from across our global sites. #IWD2026 #SamsungSemiconductor

What if the next dimension of AI memory is closer than you think? ✨ Samsung Semiconductor will present "3D Innovations in Memory & Storage Architecture" at FMS 2026. 🎤 Agentic AI is demanding more from memory than ever before. More data. More bandwidth. More capacity. Less energy. The next breakthrough may lie in a new dimension. Discover how 3D Architecture, from zHBM to zNAND, is redefining memory for the Agentic AI era. 📢 3D Innovations in Memory & Storage Architecture 📅 August 4, 2026 ⏰ 11:40 AM–12:10 PM Ready to see AI memory in 3D? 👀 Save the date and discover the next dimension of AI memory. #SamsungSemiconductor #SamsungMemory #FMS2026 #AgenticAI #3DArchitecture

Samsung Semiconductor’s Pyeongtaek Campus spans approximately 2,830,000 m², providing the physical foundation that enables AI-era memory demand to be converted into production capacity at exceptional speed and scale. 🏭 The Numbers Behind Pyeongtaek Campus • Building Area (Single Fab): ~120,000 m² • Total Floor Area (Single Fab): ~990,000 m² • Total Campus Site: ~2,830,000 m² (roughly 400 soccer fields) Within this footprint lies an ultra-clean, 24/7 manufacturing environment housing hundreds of complex, precision processes that never stop. This scale isn't just about size. This is where innovation begins. It reflects a relentless investment in future technology and marks the starting point of Samsung Semiconductor's innovation-driven differentiation strategy. What lies inside and outside a campus of this scale? Coming next in Episode 2. Stay connected. #SamsungSemiconductor #PyeongtaekCampus #ScalingSemiconductorExcellence

🔍 Predict, Optimize, Innovate: The Future of Semiconductors As AI drives unprecedented semiconductor complexity and scale, precision manufacturing has become a key competitive advantage. Digital Twins serve as virtual models of physical facilities and equipment, enabling predictive maintenance, real-time analysis, and anomaly detection. By helping minimize downtime and improve overall production efficiency, they have become increasingly essential to modern semiconductor manufacturing. At #SamsungSemiconductor, digital twins powered by semiconductor specific AI across R&D, design, and manufacturing drive a new level of quality and performance, strengthening the advancement of the AI industry. In turn, the advancement of AI industry further accelerates innovation in Digital Twin and semiconductor manufacturing technologies – creating a powerful cycle of mutual growth. This is yet another example of how Samsung Semiconductor is #ArchitectingAISystems.

How do you power the next generation of #NVIDIA AI platforms? With memory that refuses to compromise. One key technology is our HBM4, now in mass production, which combines high-speed performance and the power efficiency required for global-scale deployment. Our leadership also extends to our HBM4E 12-high configuration, set to redefine what’s possible in AI memory density and throughput. From memory and storage technologies to logic and advanced packaging, we are proud to support the innovators building the future of intelligence. Stop by booth 1207 to see what we're all about. #GTC2026 #AI #ArchitectingAISystems #BreakthroughTogether #SamsungMemory #SamsungHBM4 #SamsungSemiUS